A A N N S S I I / / T T I I A A / / E E I I A A 6 6 0 0 7 7 Commercial Building Grounding and Bonding Requirements for Telecommunications Disclaimer This information is collected and composed by QUANG DUNG TECHNOLOGY from www.Cablingdb.com. All information is copyrighted by Cablingdb.com. Standards Preservation This section is not part of the original standards documentation. The purpose of this document is to provide an easy to understand, condensed version of the original document. A basic level of telecommunications is assumed. For further information on terms and definitions see our Glossary of Terms section. Whether you are renovating your existing cable plant or installing a new one, Cablingdb.com urges you to investigate a standards based solution. This document is not meant to replace the original standards developed by the various standards bodies and we urge you to purchase the original documents through www.tiaonline.com. AUTHORIZED & EXCLUSIVE DISTRIBUTOR Head Office Suite 202, The Colonnade Building, 27 Nguyen Trung Truc St., District 1, Hochiminh City, Vietnam Tel: 84.8 823-1693 Fax: 84.8 823-1665 Hanoi Office A11, 3/Fl., Horizon Hotel, 40 Cat Linh St., Dong Da District, Hanoi, Vietnam Tel: 84.4 736-7055 Fax: 84.4 733-2470 Website: www.qd-tek.com.vn Email: info@qd-tek.com ANSI/TIA/EIA 607 Commercial Building Grounding and Bonding Requirements for Telecommunications Quang Dung Technology Distribution Company Page 2 of 7 Table of Contents OVERVIEW COMPONENTS OF THE TELECOMMUNICATIONS GROUNDING AND BONDING INFRASTRUCTURE Identification Elements Bonding Conductors for Telecommunications Telecommunications Bonding Backbone (TBB) Telecommunications Main Grounding Busbar (TMGB) Telecommunications Grounding Busbar (TGB) TELECOMMUNICATIONS ENTRANCE FACILITY TELECOMMUNICATIONS ROOM and EQUIPMENT ROOM ANSI/TIA/EIA 607 Commercial Building Grounding and Bonding Requirements for Telecommunications Quang Dung Technology Distribution Company Page 3 of 7 OVERVIEW OF THE TELECOMMUNICATIONS GROUNDING AND BONDING INFRASTRUCTURE The electrical service entrance is outside the scope of this Standard and is grounded and bonded in accordance with all applicable electrical codes. In all cases the applicable electrical codes for bonding and grounding for telecommunications shall be met. The telecommunications grounding and bonding infrastructure begins with a connection to the service equipment (power) ground and extends throughout the building. Although the electrical closet and associated panelboard(s) are not part of the telecommunications infrastructure, they are referenced because they are integral to grounding and bonding. COMPONENTS OF THE TELECOMMUNICATIONS GROUNDING AND BONDING INFRASTRUCTURE Major components of the grounding and bonding infrastructure are: • the identification elements • the bonding conductor for telecommunications • the Telecommunications Bonding Backbone (TBB) • the Telecommunications Main Grounding Busbar (TMGB) • the Telecommunications Grounding Busbar (TGB) • the Telecommunications Bonding Backbone Interconnecting Bonding Conductor (TBBIBC) All bonding conductors shall: • be listed for the purpose intended and approved by a Nationally Recognized Testing Laboratory (NRTL). • be insulated and copper. The minimum bonding conductor size shall be a No. 6 AWG. • be bonded to each end of the conduit with a No. 6 AWG ground wire at a minimum if the conductors are inserted in a metallic conduit longer than 1 m (3ft) • be marked appropriately by a distinctive green color. Labels, Color-Coding, and Markings Labels shall: • be attached to each telecommunications bonding conductor • be located on conductors as close as practicable (ie., ease of access to read the label) to their point of termination • be nonmetallic. Refer to ANSI/TIA/EIA 606 for additional labeling requirements. Bonding Conductors for Telecommunications ANSI/TIA/EIA 607 Commercial Building Grounding and Bonding Requirements for Telecommunications Quang Dung Technology Distribution Company Page 4 of 7 The bonding conductor for telecommunications shall: • bond the TMGB to the service equipment (power) ground • be, at a minimum, the same size as the TBB (see below) The Telecommunications Bonding Backbone (TBB) The TBB is a conductor: • that interconnects all TGBs with the TMGB • reduces or equalizes potential differences between telecommunications systems bonded to it. A TBB is not intended to serve as the only conductor providing a ground fault current return path. A TBB(s) originates at the TMGB, and connects to the TGB(s) in all telecommunications closets and equipment rooms. A TBB design should take into account: • type of building construction, building size • the telecommunications requirements • the configuration of the telecommunications pathways and spaces. the TBB shall: • be designed with over all design of the telecommunications backbone cabling system in mind • permit multiple TBBs as required • minimize the lengths of the TBBs • be an insulated copper conductor • have minimum conductor size of No. 6 AWG, and as large as No 3 AWG • be bonded together with a TBB interconnecting bonding conductor (TBBIBC) at the top floor and at a minimum of every third floor in between when two or more vertical TBBs are used in a multistory building • be connected to the TMGB Water pipes shall not be used as a TBB. Metallic cable shield shall not be used as a TBB in new installations. Installation Considerations TBB conductors: • shall be protected from physical and mechanical damage • should be installed without splices, where practicable. If splices are required, they: • should be minimum and shall be accessible and located in telecommunications spaces • shall be connected using irreversible compression-type connectors, exothermic welding, or equivalent • shall have joints adequately supported and protected from damage ANSI/TIA/EIA 607 Commercial Building Grounding and Bonding Requirements for Telecommunications Quang Dung Technology Distribution Company Page 5 of 7 The Telecommunications Main Grounding Busbar (TMGB) The TMBG serves as: • the dedicated extension of the building grounding electrode system for the telecommunications infrasfructure • the central attachment point for telecommunications bonding backbones (TBB) and equipment, and is located such that it is accessible to telecommunications personnel The TMGB should: • be located in the telecommunications entrance room • minimize the bonding conductor length for telecommunications • serve telecommunications equipment that is located within the same room or space. Extensions of the TMGB (i.e., other busbars) shall be telecommunications grounding busbars (TGB). Typically, there should be a single TMGB per building. The TMGB shall: • be a predrilled copper busbar provided with standard NEMA bolt hole sizing and spacing for the type of connectors to be used • be sized with the immediate requirements and future growth in mind • have minimum dimensions of 6 mm thick x 100 mm wide and a length as required. The TMGB should: • be electrotin plated for reduced contact resistance or if not plated, the busbar shall be cleaned prior to fastening of conductors. Bonding to a Panelboard for Telecommunications The TMGB shall: • be as close to the panelboard for telecommunications as is practicable • maintain clearances required by applicable electrical codes • have a panelboards Alternating Current Equipment Ground bus, or enclosure bonded to the TMGB • use listed 2-hole compression connectors, exothermic type welded connections, or equivalent for the bonding conductor connections • be bonded to all metallic raceways used for telecommunications cable within the same room or space • be insulated from its support (50mm is recommended) The TMGB should: • be located to the side of the panelboard • be located vertically based on the entrance point of the cables (eg: overhead or from below) • use 2 hole compression connectors ANSI/TIA/EIA 607 Commercial Building Grounding and Bonding Requirements for Telecommunications Quang Dung Technology Distribution Company Page 6 of 7 The Telecommunications Grounding Busbar (TGB) The (TGB) is the common connection point for telecommunications systems and equipment in the location served by that telecommunications closet or equipment room. The TGB shall: • be a predrilled copper busbar provided with standard NEMA bolt hole sizing and spacing for the type of connectors to be used • have minimum dimensions of 6 mm thick x 50 mm wide and variable in length immediate requirement with consideration of future growth • be cleaned prior to fastening the conductors to the busbar • have TBBs and other TGBs within the same space bonded to the TGB • have the a continuous bonding conductor between the TBB and TGB routed in the shortest straight line path • have a panelboards Alternating Current Equipment Ground bus, or enclosure bonded to the TGB • maintain clearances required by applicable electrical codes • have the TGB shall be bonded to the TBBIBC as per 5.3.4.2 of the original standards documentation • be bonded to all metallic raceways used for telecommunications cable within the same room or space • use listed 2-hole compression connectors to connect the TBB to the TGB • be insulated from its support (50mm is recommended) The TGB should: • be electrotin-plated for reduced contact resistance • bond the panelboard's ACEG or enclosure to the TGB if the TGB is not in the same space as the panelboard • be located to the side of the panelboard • be located vertically based on the entrance point of the cables (eg: overhead or from below) Bonding to the Metal Frame The metal frame of a building shall be bonded with a No. 6 AWG conductor to: • all TGBs where the metal frames are effectively grounded • the TGB where the metal frame is external to the room • the TMGB where the metal frame is external to the room TGBs may be grounded to horizontal steel members in lieu of vertical members if, the horizontal members are permanently electrically bonded to the vertical members. Bonding conductors and connectors for bonding the metal frame of a building shall be listed and approved for the purpose intended. This Standard does not require the steel bars of a reinforced concrete building to be bonded to the TGB or TEF. ANSI/TIA/EIA 607 Commercial Building Grounding and Bonding Requirements for Telecommunications Quang Dung Technology Distribution Company Page 7 of 7 TELECOMMUNICATIONS ENTRANCE FACILITY The TMBG: • should be located in the TEF • is the common point to which all grounding connections in a TEF are made • may serve as the TGB for collocated equipment in the TEF • should be located to facilitate the straightest route from the primary rotectors to the TMGB • shall be as close to the panelboard for telecommunications as practicable • shall be installed to maintain clearances required by applicable electrical codes Location of the TMGB • primary protectors shall be separated by a minimum of 300mm (1ft) from any DC power, switchboard or high frequency cables even when these cable are contained in metallic or EMT conduit • the TMGB should be located near the backbone cabling and associated terminations • the TMGB should be located so that the bonding conductor for telecommunications is as short and straight as possible. Other Attachments to the TMGB/TGB The following elements shall be bonded to the TMGB/TGB • the shield or metallic member of a backbone cable • telecommunications primary protectors on the inter-building backbone cables • the pathway on the building side of an isolation gap in the telecommunications entrance facility TELECOMMUNICATIONS ROOM and EQUIPMENT ROOM The TGB shall: • be located in each telecommunications room and equipment room • be insulated from its support and separated by a minimum of 50mm • be located to provide the greatest flexibility and accessibility for telecommunications system grounding by minimizing lengths and number of bends of the bonding conductor to the TGB • be bonded together with all other TGBs in the same space The TGB should: • be located near the backbone cabling and associated terminations if no panelboard has been installed in the telecommunications room • be located so that the grounding conductors are as short and straight as possible . ANSI /TIA/ EIA 606 for additional labeling requirements. Bonding Conductors for Telecommunications ANSI /TIA/ EIA 607 Commercial Building Grounding and Bonding. 73 3-2 470 Website: www.qd-tek.com.vn Email: info@qd-tek.com ANSI /TIA/ EIA 607 Commercial Building Grounding and Bonding Requirements for Telecommunications Quang